• KAL Series

KAL Series

QFN package tape
QFN Tape /Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature
Application / Heat Press Tape / FPC Tape

♠  Used in QFN molding process, to avoid EPOXY bleeding.
♠  Polyimide film coated with specially formulated silicone adhesive. Consistent, Stable at high temperature, leaves no residue.
Product Code Product Description Physical Property Applications
KAL278 PI Film w/ liner Total Thickness 33 um QFN molding process
Adhesion 0.1  kg/in.
KAL279 PI Film w/ liner Total Thickness 35 um QFN molding process
Adhesion 0.1~0.25  kg/in.

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