KAL Series
QFN package tape
QFN Tape /Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature
Application / Heat Press Tape / FPC Tape
QFN Tape /Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature
Application / Heat Press Tape / FPC Tape
♠ Used in QFN molding process, to avoid EPOXY bleeding.
♠ Polyimide film coated with specially formulated silicone adhesive. Consistent, Stable at high temperature, leaves no residue.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| KAL278 | PI Film w/ liner | Total Thickness | 33 | um | QFN molding process |
| Adhesion | 0.1 | kg/in. | |||
| KAL279 | PI Film w/ liner | Total Thickness | 35 | um | QFN molding process |
| Adhesion | 0.1~0.25 | kg/in. | |||
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