• UET / UPT Series

UET / UPT Series

UV Release Tape, Wafer Dicing Tape
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)

♠  Used with UV light exposure (with certain wave length), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
♠  Good for heat resistant purposes.
♠  Used in wafer back grinding, chip dicing, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.
 Anti-static version is available.


Product Code Product Description Physical Property Applications
UET101 PET Film Total Thickness 125 um  Semiconductor dicing
Before UV curing 2 ↑  kg/in.
After UV curing 0.03 ↓  kg/in.
UET103P PET Film Total Thickness 120 um
Before UV curing 1.6 ↑ kg/in
After UV curing 0.03 ↓ kg/in
UET123P PET Film Total Thickness 125 um
Before UV curing 2.0 ↑  kg/in.
After UV curing 0.03 ↓ kg/in.
UPT155 PO Film Total Thickness 170 um
Before UV curing 1.2 ↑  kg/in.
After UV curing 0.05 ↓  kg/in.
UPT152-3 PO Film Total Thickness 125 um
Before UV curing 1.5 ↑  kg/in.
After UV curing 0.05 ↓  kg/in.
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