UET / UPT Series
UV Release Tape, Wafer Dicing Tape
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)
♠ After UV light exposure (with certain wave length), the adhesion is greatly reduced
(irreversible reaction), the object can be easily removed and picked up.
♠ Good for heat resistant purposes.
♠ Used in wafer back grinding, chip dicing, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.
♠ Anti-static version is available.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| UET101 | PET Film+Liner | Total Thickness | 125 | um | Semiconductor dicing |
| Before UV curing | 2 ↑ | kg/in. | |||
| After UV curing | 0.03 ↓ | kg/in. | |||
| UET113P | PET Film+Liner | Total Thickness | 110 | um | |
| Before UV curing | 0.9 ↑ | kg/in | |||
| After UV curing | 0.03 ↓ | kg/in | |||
| UET123P | PET Film+Liner | Total Thickness | 125 | um | |
| Before UV curing | 2.0 ↑ | kg/in. | |||
| After UV curing | 0.03 ↓ | kg/in. | |||
| UPT155 | PO Film+Liner | Total Thickness | 170 | um | |
| Before UV curing | 1.2 ↑ | kg/in. | |||
| After UV curing | 0.05 ↓ | kg/in. | |||
| UPT152-11 | PO Film+Liner | Total Thickness | 170 | um | |
| Before UV curing | 1.2 ↑ | kg/in. | |||
| After UV curing | 0.05 ↓ | kg/in. | |||
