• POL Series

POL Series

Wafer BG tape,Dicing tape
Wafer Back griniding / Wafer thinning / Wafer Dicing

♠  High flatness and great elongation for wafer back grinding / thinning protection, substrate cutting.
♠  Lift-off cleaning. 
♠  Film peeler, film remover.


Product Code Product Description Physical Property Applications
POL143 PO Film Total Thickness 170 um Wafer back grinding / thinning
Adhesion 0.15 kg/in.
POL146 PO Film Total Thickness 170 um
Adhesion  0.35  kg/in.
POL803 PO Film Total Thickness 95 um Wafer dicing, substrate cutting
Lift-off cleaning
Adhesion 0.2 kg/in.
POL804 PO Film Total Thickness 93 um Wafer back grinding / thinning
Substrate cutting
Adhesion 0.1~0.25 kg/in
ETT293 PET Film Total Thickness 55 um Peel off BG tape after grinding
Adhesion 1.2 ↑ kg/in
ETT548R PET with Liner Total Thickness 100 um
Adhesion 1.5 ↑ kg/in
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