POL Series
Wafer BG tape,Dicing tape
Wafer Back griniding / Wafer thinning / Wafer Dicing
Wafer Back griniding / Wafer thinning / Wafer Dicing
♠ High flatness and great elongation for wafer back grinding / thinning protection, substrate cutting.
♠ Lift-off cleaning.
♠ Film peeler, film remover.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| POL143 | PO Film | Total Thickness | 170 | um |
Wafer back grinding / thinning |
| Adhesion | 0.15 | kg/in. | |||
| POL146 | PO Film | Total Thickness | 170 | um | |
| Adhesion | 0.35 | kg/in. | |||
| POL803 | PO Film | Total Thickness | 95 | um |
Wafer dicing, substrate cutting Lift-off cleaning |
| Adhesion | 0.2 | kg/in. | |||
| POL804 | PO Film | Total Thickness | 93 | um |
Wafer back grinding / thinning Substrate cutting |
| Adhesion | 0.1~0.25 | kg/in | |||
| ETT293 | PET Film | Total Thickness | 55 | um | Peel off BG tape after grinding |
| Adhesion | 1.2 ↑ | kg/in | |||
| ETT548R | PET with Liner | Total Thickness | 100 | um | |
| Adhesion | 1.5 ↑ | kg/in | |||
