Despite of wafer dicing tape, the application of dicing tape can be on variety substrates, such as ceramic substrate, LED substrate, PCB substrate, HDI (High Density Interconnect) PCB substrate, resistor or capacitor cutting, epoxy substrate, or QFN substrate...etc.
How to choose a right tape for substrate cutting? It depends on the hardness of the substrate; the material of the tape is able to support the substrate firmly without too "bouncing" or soft. The dicing tape is not only for fixing the substrate as a carrier, as well as preventing the tiny components moving.
After the cutting process, using UV light our thermal curing on the tape to release the product and then going to next step process.
Dicing tape is usually attached on metal frame for carrying substrates.