UV Release Dicing Tape
Solar plus company produces UV release tape (dicing tape) for semiconductor production process. UV release tapes are used in wafer back grinding or wafer dicing. After UV light curing on the tape, the adhesion drops and let the tape release from the substrate. It has been used wildly in semiconductor front end production process.
UV double side tape is the newest inquiry in semiconductor industry recently.
How to shorten the time in the production process for semiconductor industry, is the most important project that Solar plus is focusing on.