UV dicing release tape
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)
♠ After UV light exposure (with certain wave length), the adhesion is greatly reduced
(irreversible reaction), the object can be easily removed and picked up.
♠ Good for heat resistant purposes.
♠ Used in wafer back grinding, chip dicing, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.
♠ Anti-static version is available.
Model
Material
Physical Property
Applications
UET101
PET Film+Liner
Total Thickness
125
µm
Semiconductor dicing
Before UV release
2↑
kg/in
After UV release
0.03↓
kg/in
UET113P
PET Film+Liner
Total Thickness
110
µm
Before UV release
0.9 ↑
kg/in
After UV release
0.03 ↓
kg/in
UET123P
PET Film+Liner
Total Thickness
125
µm
Before UV release
2.0 ↑
kg/in
After UV release
0.03↓
kg/in
UPT155
PO Film+Liner
Total Thickness
170
µm
Before UV release
1.2↑
kg/in
After UV release
0.05 ↓
kg/in
UPT152-11
PO Film+Liner
Total Thickness
170
µm
Before UV release
1.2↑
kg/in
After UV release
0.05↓
kg/in
