Thermal release tape
♠ Main applications are for protection or carrier.
♠ Provides enough holding adhesion during dicing operation at regular temperature, objects are not moved, nor flying. Easily released after heating.
♠ Thermal release temperature：85℃, 90℃, 120℃, 150℃, 190℃ or the highest temperature 260℃.
♠ For wafer dicing, chip dicing, sputtering process, MLCC dicing, LED dicing, substrate cutting, lens cutting, nameplate cutting or any semiconductor Industry production process.
Can't find what you need? Solar Plus provides custom made tapes. Contact us now!
Model
Material
Physical Property
Temp.
FCL70810-1
PET Film w/ Liner
Total thickness
150 ± 8
um
Release Temperature
85℃ , 3-5 min
Adhesion
Before Heating
0.6 ↑
kg/in
Adhesion
After Heating
0.015 ↓
kg/in
FCL70950
PET Film w/ Liner
Total thickness
95 ± 5
um
Release Temperature
90℃ , 3-5 min
Adhesion
Before Heating
0.4-0.7
kg/in
Adhesion
After Heating
0.015 ↓
kg/in
FCL90980-1
PET Film w/ Liner
Total thickness
125 ± 7
um
Release Temperature
100℃ , 3-5 min
Adhesion
Before Heating
1.2 ↑
um
Adhesion
After Heating
0.015 ↓
kg/in
FCL125-6
PET Film w/ Liner
Total thickness
130 ± 7
um
Release Temperature
120℃ , 3-5 min
Adhesion
Before Heating
1.0 ↑
kg/in
Adhesion
After Heating
0.015↓
kg/in
FCL71538-6
PET Film w/ Liner
Total thickness
91 ± 5
um
Release Temperature
150℃ , 3-5 min
Adhesion
Before Heating
0.4 ↑
kg/in
Adhesion
After Heating
0.015↓
kg/in
FCL72010
PET Film w/ Liner
Total thickness
150 ± 8
um
Release Temperature
200℃ , 3-5 min
Adhesion
Before Heating
0.3 ↑
kg/in
Adhesion
After Heating
0.015↓
kg/in
