The application of semiconductor tape for front and end process.

Front end process :

Wafer BG tape → De-taping tape → Lift off removing → Wafer cassette sealing

Back end process:

Wafer Dicing → IC packaging → lead frame cutting → reel or tray packing

The application of semiconductor tape is variety, not only IC process using the high performance tape, more and more electronic component production process are starting using them. Solar plus company provides custom made service and professional consulting. Contact us for further information.

Applications:

♠ For semiconductor production process: Backing, dicing, masking, protection, carrying or wafer grinding process tape.

♠ Custom made tape for any possibility.