De-Taping Tape
♠ De taping non UV release wafer back grinding tape.
♠ Peeling off large surface protection film on screen or device.
♠ High cleanness and anti-static for semiconductor industry.
Model
Material
Physical Property
Applications
ETT293
PET
Total Thickness
55
µm
Wafer de-Taping Tape
Custom long length for fitting de-taping machine.
Or peeling off large adhesive film
Adhesion
1.2↑
kg/in
ETT548R
PET
Total Thickness
61
µm
Adhesion
0.002~0.006
kg/in
ETT588R-5
PET
Total Thickness
85
µm
Adhesion
1.2↑
kg/in
GTT601RAS
PET
Total Thickness
90
µm
Anti-Static
PSA: 108~1011 ~ Ω/sq.
Film: 106~109 ~ Ω/sq.
Adhesion
0.7
kg/in
SAT293
PET
Total Thickness
53 ± 3
µm
Anti-Static
Film: 104~108 ~ Ω/sq.
Adhesion
1.0↑
kg/in
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