LE Series
UV release tape, UV dicing tape
UV Low energy version
UV Low energy version
♠ Used with UV light exposure (with certain wavelength), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
♠ Good for dicing and heat resistant purposes.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, lead frame cutting, LED frame cutting or name plate cutting.
♠ Anti-static version is available.
♠ Low energy release, speed up the production process.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| UPT143LE | PO Film | Total Thickness | 170 | um | Dicing, grinding, great expansion |
| Before UV | 2.5 | kg/in. | |||
| After UV | 0.03 | kg/in. | |||
| UPT152LE | PO Film | Total Thickness | 172 | um |
Dicing, grinding, great expansion Lead frame cutting |
| Before UV | 1.8 ↑ | kg/in. | |||
| After UV | 0.03 ↓ | kg/in. | |||
| UPT805-4LE | PO Film | Total Thickness | 90 | um | Dicing, great expansion |
| Before UV | 0.3 ↑ | kg/in. | |||
| After UV | 0.05 ↓ | kg/in. | |||
