• LE Series

LE Series

UV release tape, UV dicing tape
UV Low energy version

♠ Used with UV light exposure (with certain wavelength), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
♠ Good for dicing and heat resistant purposes.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, lead frame cutting, LED frame cutting or name plate cutting.
 Anti-static version is available.
 Low energy release, speed up the production process.

Product Code Product Description Physical Property Applications
UPT143LE PO Film Total Thickness 170 um  Dicing, grinding, great expansion
Before UV 2.5  kg/in.
After UV 0.03  kg/in.
UPT152LE PO Film Total Thickness 172 um Dicing, grinding, great expansion
Lead frame cutting
Before UV 1.8 ↑  kg/in.
After UV 0.03 ↓  kg/in.
UPT805-4LE PO Film Total Thickness 90 um Dicing, great expansion
Before UV 0.3 ↑  kg/in.
After UV 0.05 ↓  kg/in.
Can't find what you need? Solar Plus provides custom made tapes. Contact us now! proimages/Product_2020/mail_yellow-s.png

Related Products

UAS Series

UAS Series

UDD / UTD Series

UDD / UTD Series

UET / UPT Series

UET / UPT Series