UV Release tape low energy
UV release tape, UV dicing tape
UV Low energy version
UV Low energy version
Model :
LE
♠ Used with UV light exposure (with certain wavelength), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
♠ Good for dicing and heat resistant purposes.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, lead frame cutting, LED frame cutting or name plate cutting.
♠ Anti-static version is available.
♠ Low energy release, speed up the production process.
| Model | Material | Physical Property | Applications | ||
| UPT143LE | PO Film + Liner | Total Thickness | 170 | µm | Dicing, grinding, great expansion |
| Before UV release | 2.5 | kg/in | |||
| After UV release | 0.03 | kg/in | |||
| UPT152LE | PO Film + Liner | Total Thickness | 172 | µm |
Dicing, grinding, great expansion Lead frame cutting |
| Before UV release | 1.8 ↑ | kg/in | |||
| After UV release | 0.03 ↓ | kg/in | |||
| UPT805LE | PO Film + Liner | Total Thickness | 86 | µm | Dicing, great expansion |
| Before UV release | 0.5~0.9 | kg/in | |||
| After UV release | 0.015↓ | kg/in | |||
| UPT104LE | PO Film + Liner | Total Thickness | 125 | µm |
Dicing, grinding, great expansion Lead frame cutting |
| Before UV release | 1.3 ↑ | kg/in | |||
| After UV release | 0.02 ↓ | kg/in | |||
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