• KAL Series

KAL Series

QFN package tape / QFN Tape / Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature
Application / Heat Press Tape / FPC Tape

♠  Used in QFN molding process, to avoid EPOXY bleeding.
♠  Polyimide film coated with special formulated silicone adhesive. 
♠  Consistently stable at high temperature, no residue after peeling off.

Product Code Product Description Physical Property Applications
KAL278 PI Film w/ liner Total Thickness 33 um QFN molding process
Adhesion 0.1  kg/in.

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