KAL Series
QFN package tape / QFN Tape / Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature
Application / Heat Press Tape / FPC Tape
Application / Heat Press Tape / FPC Tape
♠ Used in QFN molding process, to avoid EPOXY bleeding.
♠ Polyimide film coated with special formulated silicone adhesive.
♠ Consistently stable at high temperature, no residue after peeling off.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| KAL278 | PI Film w/ liner | Total Thickness | 33 | um | QFN molding process |
| Adhesion | 0.1 | kg/in. | |||
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