Anti-static UV release tape
♠ Curing with UV light exposure (with certain wavelength), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed or picked up.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, DFN dicing or lead frame cutting.
♠ Anti-static on adhesive or film.
♠ Low energy release, speed up the production process.
Ｍodel
Material
Physical Property
Applications
UPT641-4
PO film with
Anti-static adhesive
Total Thickness
160 ± 9
μm
Chip, substrate or
DFN dicing
Before UV
1.8↑
kg/in
After UV
0.05↓
kg/in
UPT152-AS
Anti-static PO Film
Total Thickness
170 ± 9
μm
Chip dicing, substrate dicing
Before UV
1.2↑
kg/in
After UV
0.03↓
kg/in
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