Anti-static UV release tape, UV dicing tape
♠ Curing with UV light exposure (with certain wavelength), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed or picked up.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, DFN dicing or lead frame cutting.
♠ Anti-static on adhesive or film.
♠ Low energy release, speed up the production process.
|Product Code||Product Description||Physical Property||Applications|
PO film with
|Total Thickness||160 ± 9||um||
Chip dicing, substrate dicing,
|Before UV||1.8 ↑||kg/in.|
|UPT152-11AS||Anti-static PO Film||Total Thickness||170 ± 9||um||
Chip dicing, substrate dicing
|Before UV||1.2 ↑||kg/in.|
|After UV||0.03 ↓||kg/in.|
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