UAS Series
Anti-static UV release tape, UV dicing tape
♠ Curing with UV light exposure (with certain wavelength), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed or picked up.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, DFN dicing or lead frame cutting.
♠ Anti-static on adhesive or film.
♠ Low energy release, speed up the production process.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| UPT641-4 |
PO film with Anti-static adhesive |
Total Thickness | 160 ± 9 | um |
Chip dicing, substrate dicing, DFN dicing |
| Before UV | 1.8 ↑ | kg/in. | |||
| After UV | 0.05↓ | kg/in. | |||
| UPT152-11AS | Anti-static PO Film | Total Thickness | 170 ± 9 | um |
Chip dicing, substrate dicing |
| Before UV | 1.2 ↑ | kg/in. | |||
| After UV | 0.03 ↓ | kg/in. | |||
Can't find what you need? Solar Plus provides custom made tapes. Contact us now! 
