Polyimide Tape
Model :
KA
♠ Used in masking operation during wave solder process on PCB, prevent electroplating liquid immersion and polluting.
♠ Insulation and high heat dissipation for lithium battery wrapping.
♠ Wiring in heater, power supply and flexible printed circuit board.
| Model | Material | Physical Property | Applications | ||
|
KA105 KA105#50 KA105#125 |
PI Film+Silicone | Thickness | 57 | µm |
Different film thickness (25、50、75、125µm)， with or w/o liner For PCB gold finger masking, painting masking |
| Thickness | 86 | µm | |||
| Thickness | 161 | µm | |||
| Adhesion | 0.5 ↑ | kg/in | |||
| Temp. | 290 | ℃ | |||
|
KA104 KA104#50 |
PI Film+Silicone | Thickness | 61 | µm |
For PCB gold finger masking, painting masking |
| Thickness | 86 | µm | |||
| Adhesion | 0.65 ↑ | kg/in | |||
| Temp. | 260 | ℃ | |||
| KA214 | PI Film+Silicone | Thickness | 35 | µm | Low adhesion for fixing |
| Adhesion | 0.1-0.15 | kg/in | |||
| Temp. | 260 | ℃ | |||
| KA105RP | PI Film+Silicone | Thickness | 61 | µm | |
| Adhesion | 0.5↑ | kg/in | |||
| Temp. | 290 | ℃ | |||
| KA102 | PI + Acrylic | Thickness | 56 | µm | Lithium battery wrapping |
| Adhesion | 0.7 ↑ | kg/in | |||
| Temp. | 180 | ℃ | |||
| KAL268 | PI + Acrylic | Thickness | 57 | µm | Lithium battery wrapping |
| Adhesion | 0.7 ↑ | kg/in | |||
| Temp. | 180 | ℃ | |||
| KAL605 |
PI Film+Silicone w/ Liner |
Thickness | 61 | µm | Chip in high temperature process and soaking |
| Adhesion | 0.5 ↑ | kg/in | |||
| Temp. | 290 | ℃ | |||
| PSA Anti-static | 108~1011 | Ω/sq | |||
| KA605AS | PI Film+Silicone | Thickness | 61 | µm |
Chip in high temperature process and soaking |
| Adhesion | 0.5 ↑ | kg/in | |||
| Temp. | 290 | ℃ | |||
| PSA Anti-static | 108~1011 | Ω/sq | |||
| Film Anti-static | 103~108 | Ω/sq | |||
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