The tapes used in semiconductor manufacturing processes are generally not desired to contain silicon components. One of the reasons for this is that 'silicon' is the primary material of the wafer. If the tape used in the process contains silicon, it may cause silicon atoms to contaminate the wafer surface due to tape wear or residue.

If silicon atoms enter the single-crystal silicon structure of the wafer in an unintended manner, they can disrupt the arrangement of the wafer's own silicon atoms, affecting important electrical characteristics such as conductivity, electron mobility, and carrier lifetime.

If the  silicon type of tape may cause silicon atoms to contaminate the wafer surface due to tape wear or residue. (Pic from Gemini AI)

Therefore, in semiconductor manufacturing processes, tapes that need to 'directly contact' the wafer surface typically avoid using materials containing silicon components to prevent contamination of the wafer and interference with subsequent processes.

The base materials and adhesives of semiconductor tapes are usually made of acrylic adhesive, combined with silicon-free films such as PO, PI, and PET films. Solar plus company provides silicon-free tapes and adhesive films, which are designed for silicon-free contamination processes.

UV dicing tapes, thermal release tapes, wafer back grinding tape, high-temperature and masking tapes are all preferred products for semiconductor manufacturing processes.
Contact us if you couldn't find the ideal tape, Solar Plus company provides customized service.