With the development of AI and the evolution of advanced semiconductor processes, Solar Plus company has diversified its production of semiconductor tapes. Thermal release tapes could not achieve high-temperature release applications. However, in response to customer demands, we have actively researched and developed thermal release tapes capable of withstanding temperatures up to about 260°C.

These tapes can now be applied in front-end semiconductor processes, such as metallization, where they protect wafers from high temperatures encountered during the metallization process.

The high temperature thermal release tape can be used for metallization process

In addition to front-end process applications, thermal release tapes are widely used in back-end semiconductor packaging processes. They enable components to be quickly released from masking tapes without leaving any residue on the finished products.

The applications of thermal release tapes are extensive. Besides the semiconductor industry, these tapes are also utilized in panel production and traditional industries for protection, fixation, and transfer processes in automated production lines. This helps improve processes, enhance efficiency, and reduce labor costs.

High temperature resistance thermal release tapes are made of PI film, which can be custom made into special double-sided tapes for high temperature resistance. Or the tape can be designed as one side thermal release, the other side with UV release function. This innovative concept and process improvement offer precise control in complex processing tasks.