SEMICON Taiwan 2026 was grandly held from September 2 to 4 under the theme "Transform Tomorrow." Spanning eight floors across Halls 1 and 2 of the Taipei Nangang Exhibition Center, the event was organized by technical themes, national pavilions, and special categories. This year's hottest discussions continued to focus on AI, silicon photonics, advanced manufacturing processes, advanced packaging, and quantum technology.

The exhibition featured 15 major thematic zones. In the Strategic Materials zone, Solar Plus Company highlighted cross-domain breakthroughs in process tape applications. Traditionally, distinct tape solutions were strictly categorized for front-end versus back-end semiconductor manufacturing processes. However, driven by customer demand for process innovation and optimization, many front-end and back-end tapes are now being flexibly adapted across different processing stages.

To identify the ideal tape solution, customers typically focus on film and adhesive thickness, hardness, adhesion strength, heat resistance, and chemical resistance (acid/alkali). In recent years, there has also been growing demand for ultra-low temperature performance below sub-zero temperatures (-10°C or lower).

Solar Plus Company showcased the following key products:

Wafer Grinding Tape
UV Dicing Tape
Thermal Release Tape
Double-Sided Multifunctional Release Tape
Photoresist Cleaning Tape
Detaping Tape
QFN Tape
High-Temperature PI Silicone Masking Tape

Solar Plus Company also provides customized design solutions to meet the requirements of clients' advanced manufacturing processes.